Invention Grant
- Patent Title: Elastic wave device
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Application No.: US16179006Application Date: 2018-11-02
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Publication No.: US11677378B2Publication Date: 2023-06-13
- Inventor: Ryosuke Sakai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 2017229527 2017.11.29 JP 2018192316 2018.10.11
- Main IPC: H03H9/05
- IPC: H03H9/05 ; H03H9/10 ; H03H9/25 ; H03H9/64 ; H03H9/02 ; H03H9/145 ; H10N30/87 ; H10N30/853

Abstract:
An elastic wave device includes a piezoelectric thin film, IDT electrodes on the piezoelectric thin film, an insulating layer surrounding the piezoelectric thin film on a primary surface of a support substrate, a spacer layer surrounding the piezoelectric thin film in plan view, and a cover on the spacer layer. The spacer layer includes an outer edge and an inner edge closer than the outer edge to the piezoelectric thin film in plan view. The primary surface of the insulating layer closer to the spacer layer includes a sloping region that extends where the insulating layer overlaps the spacer layer in plan view and in which the distance from the first primary surface of the support substrate along the direction perpendicular or substantially perpendicular to the support substrate increases from the outer edge toward the inner edge.
Public/Granted literature
- US20190165758A1 ELASTIC WAVE DEVICE Public/Granted day:2019-05-30
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