Invention Grant
- Patent Title: Audio device mount assembly
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Application No.: US17539166Application Date: 2021-11-30
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Publication No.: US11678095B2Publication Date: 2023-06-13
- Inventor: Vincent William Ellis , William John Done
- Applicant: Biamp Systems, LLC
- Applicant Address: US OR Beaverton
- Assignee: Biamp Systems, LLC
- Current Assignee: Biamp Systems, LLC
- Current Assignee Address: US OR Beaverton
- Main IPC: H04R1/02
- IPC: H04R1/02

Abstract:
Example embodiments provide a device that includes a housing backplate affixed to a housing which embodies one or more of a speaker and a microphone, a threaded channel affixed to the housing and extending perpendicular from the housing backplate, and a wall mount fitting with one or more securing tabs to hold the wall mount fitting to a wall mount plate.
Public/Granted literature
- US20220095025A1 AUDIO DEVICE MOUNT ASSEMBLY Public/Granted day:2022-03-24
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