Invention Grant
- Patent Title: Printed circuit board assembly for edge-coupling to an integrated circuit
-
Application No.: US16560517Application Date: 2019-09-04
-
Publication No.: US11678433B2Publication Date: 2023-06-13
- Inventor: Richard D. Neufeld
- Applicant: D-WAVE SYSTEMS INC.
- Applicant Address: CA Burnaby
- Assignee: D-WAVE SYSTEMS INC.
- Current Assignee: D-WAVE SYSTEMS INC.
- Current Assignee Address: CA Burnaby
- Agency: Cozen O'Connor
- Main IPC: H05K7/06
- IPC: H05K7/06 ; B23P19/00 ; H05K1/02 ; H05K1/09 ; H05K1/14 ; H05K3/30 ; H01R24/50 ; H01R25/00 ; H01L39/04 ; H01R103/00

Abstract:
Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.
Public/Granted literature
- US20200084882A1 PRINTED CIRCUIT BOARD ASSEMBLY FOR EDGE-COUPLING TO AN INTEGRATED CIRCUIT Public/Granted day:2020-03-12
Information query