Invention Grant
- Patent Title: Method and circuit for controlling quality of metallization of a multilayer printed circuit board
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Application No.: US17286939Application Date: 2019-11-14
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Publication No.: US11678434B2Publication Date: 2023-06-13
- Inventor: Daniel Guerra , Philippe Lehue
- Applicant: Continental Automotive France , Continental Automotive GmbH
- Applicant Address: FR Toulouse
- Assignee: Continental Automotive France,Continental Automotive GmbH
- Current Assignee: Continental Automotive France,Continental Automotive GmbH
- Current Assignee Address: FR Toulouse
- Agency: RatnerPrestia
- Priority: FR 60575 2018.11.16
- International Application: PCT/EP2019/081363 2019.11.14
- International Announcement: WO2020/099579A 2020.05.22
- Date entered country: 2021-04-20
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A multilayer printed circuit having a control circuit including n vias that are connected in series between a first and a second electrical terminal so that an applied electric current passes at least partially through each one of the n vias. The control circuit includes track portions in each one of the layers, each one of the n vias connecting a track portion of one layer to a track portion of another layer. The control circuit includes a measurement device for measuring a potential difference across its terminals, storage for storing a threshold value and a comparator for comparing the potential difference with the threshold value so as to validate the printed circuit when the potential difference is lower than the threshold value.
Public/Granted literature
- US20220240377A1 METHOD AND CIRCUIT FOR CONTROLLING QUALITY OF METALLIZATION OF A MULTILAYER PRINTED CIRCUIT BOARD Public/Granted day:2022-07-28
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