Invention Grant
- Patent Title: Memory layout for reduced line loading
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Application No.: US16934192Application Date: 2020-07-21
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Publication No.: US11678494B2Publication Date: 2023-06-13
- Inventor: Chih-Yang Chang , Wen-Ting Chu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- The original application number of the division: US16156026 2018.10.10
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L27/24 ; H01L23/528 ; H01L23/522 ; H01L45/00

Abstract:
Various embodiments of the present application are directed a memory layout for reduced line loading. In some embodiments, a memory device comprises an array of bit cells, a first conductive line, a second conductive line, and a plurality of conductive bridges. The first and second conductive lines may, for example, be source lines or some other conductive lines. The array of bit cells comprises a plurality of rows and a plurality of columns, and the plurality of columns comprise a first column and a second column. The first conductive line extends along the first column and is electrically coupled to bit cells in the first column. The second conductive line extends along the second column and is electrically coupled to bit cells in the second column. The conductive bridges extend from the first conductive line to the second conductive line and electrically couple the first and second conductive lines together.
Public/Granted literature
- US20200350369A1 MEMORY LAYOUT FOR REDUCED LINE LOADING Public/Granted day:2020-11-05
Information query
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