Invention Grant
- Patent Title: Three-dimensional stacked phase change memory and preparation method thereof
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Application No.: US17043672Application Date: 2019-09-23
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Publication No.: US11678495B2Publication Date: 2023-06-13
- Inventor: Hao Tong , Wang Cai , Xiangshui Miao
- Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Applicant Address: CN Hubei
- Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: CN Hubei
- Agency: JCIP Global Inc.
- Priority: CN 1910828704.0 2019.09.03
- International Application: PCT/CN2019/107182 2019.09.23
- International Announcement: WO2021/042422A 2021.03.11
- Date entered country: 2020-09-30
- Main IPC: H10B63/00
- IPC: H10B63/00 ; H10N70/00 ; H10N70/20

Abstract:
The disclosure belongs to the technical field of microelectronic devices and memories, and discloses a three-dimensional stacked phase change memory and a preparation method thereof. The preparation method includes: preparing a multilayer structure in which horizontal electrode layers and insulating layers are alternately stacked, then performing etching to form trenches and separated three-dimensional strip electrodes, next filling the trenches with an insulating medium, and then forming small holes at the boundary region between the three-dimensional strip electrodes and the insulating medium, thereafter sequentially depositing a phase change material on the walls of the small holes, and filling the small holes with an electrode material to prepare vertical electrodes, so as to obtain a three-dimensional stacked phase change memory stacked in multiple layers. By improving the overall process of the preparation method, the disclosure realizes the establishment of a three-dimensional phase change memory array by using a vertical electrode structure.
Public/Granted literature
- US20220271089A1 THREE-DIMENSIONAL STACKED PHASE CHANGE MEMORY AND PREPARATION METHOD THEREOF Public/Granted day:2022-08-25
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