A module includes components on an upper surface and a lower surface of a substrate, a second sealing resin layer laminated on the upper surface of the substrate, a first sealing resin layer on the lower surface of the substrate, and terminal blocks on the lower surface of the substrate. Each of the terminal blocks is formed by integrating a plurality of connection conductors, each of the plurality of connection conductors including a terminal portion and a substrate connecting portion formed by bending an end portion of the connection conductor, and each of the terminal blocks forms an external connection terminal of the module or functions as a shield wall for the components. Each of the terminal blocks 6 can be formed by mounting a terminal assembly onto the lower surface of the substrate, sealing the terminal assembly with a resin, and removing connecting portions.