Invention Grant
- Patent Title: Semiconductor package and package substrate including vent hole
-
Application No.: US17525388Application Date: 2021-11-12
-
Publication No.: US11682614B2Publication Date: 2023-06-20
- Inventor: Hyun Chul Seo , Jun Sik Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR 20210086125 2021.06.30
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H05K1/02 ; H01L23/31
Abstract:
A semiconductor package includes a semiconductor chip and a package substrate. The semiconductor chip is mounted on the package substrate. The package substrate includes a dielectric layer through which a vent hole penetrates, trace patterns disposed on the dielectric layer, and a protecting block disposed between the trace patterns and the vent hole.
Public/Granted literature
- US20230005829A1 SEMICONDUCTOR PACKAGE AND PACKAGE SUBSTRATE INCLUDING VENT HOLE Public/Granted day:2023-01-05
Information query
IPC分类:
