An embodiment relates to a method and manufacture of robust, high-performance devices. The method comprises preparing a unit cell of a Silicon Carbide (SiC) substrate comprising a first conductivity type substrate and a first conductivity type drift layer; forming a second conductivity type well region; forming a first conductivity type source region within the second conductivity type well region; and forming a second conductivity type shield region surrounding the first conductivity type source region. The second conductivity type shield region formed comprises a portion of the second conductivity type shield region located on a SiC surface.