Invention Grant
- Patent Title: Semiconductor device having a high breakdown voltage
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Application No.: US17331152Application Date: 2021-05-26
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Publication No.: US11682696B2Publication Date: 2023-06-20
- Inventor: Ahmed Mahmoud , Franz Hirler , Marco Mueller , Rolf Weis
- Applicant: Infineon Technologies Dresden GmbH & Co. KG
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH & Co. KG
- Current Assignee: Infineon Technologies Dresden GmbH & Co. KG
- Current Assignee Address: DE Dresden
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP 177180 2020.05.28
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/761 ; H01L29/40

Abstract:
A semiconductor device includes a layer stack with first and second semiconductor layers of complementary doping types are arranged alternatingly between first and second surfaces of the layer stack. A first semiconductor region adjoins the first semiconductor layers and has a first end arranged in a first device region and extends from the first end into a second device region. Second semiconductor regions adjoin at least one of the second semiconductor layers. A third semiconductor region adjoins the first semiconductor layers. The first semiconductor region extends from the first device region into the second device region and is spaced apart from the third semiconductor region. The second semiconductor regions are arranged between, and spaced apart from, the third and first semiconductor regions. A fourth semiconductor region adjoins the first semiconductor layers, is spaced apart from the first semiconductor region, and is arranged in the first device region between the first end of the first semiconductor region and the third semiconductor region.
Public/Granted literature
- US20210376066A1 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME Public/Granted day:2021-12-02
Information query
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