Invention Grant
- Patent Title: Shielded connector assemblies with temperature and alignment controls
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Application No.: US17229933Application Date: 2021-04-14
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Publication No.: US11682864B2Publication Date: 2023-06-20
- Inventor: Andrew Kolak , Dominic Steier , Li Zhuang , Scott Sommers
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Main IPC: H01R13/6471
- IPC: H01R13/6471 ; H01R13/6583 ; H01R13/629 ; H01R43/24 ; H01R13/502 ; H01R12/70 ; H01R12/71 ; H01R13/6587 ; H01R13/514 ; H01R13/6581 ; H01R13/506

Abstract:
Various examples of high speed connectors and connector assemblies that use connector side plate designs and include structures for improved thermal performance are described. In one example, a connector assembly includes a housing, a side plate on one side of the housing, and a wafer assembly that includes a row of conductors and a protrusion, with the protrusion being located at one end of the row of conductors. The side plate can include an aperture, and the protrusion can be inserted into the aperture to align the row of conductors.
Public/Granted literature
- US20210336360A1 SHIELDED CONNECTOR ASSEMBLIES WITH TEMPERATURE AND ALIGNMENT CONTROLS Public/Granted day:2021-10-28
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