Invention Grant
- Patent Title: Efficient and robust system design and control method using thermoelectric cooling
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Application No.: US17212075Application Date: 2021-03-25
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Publication No.: US11683916B2Publication Date: 2023-06-20
- Inventor: Shuai Shao , Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G05B15/02 ; H01L23/38 ; G06F1/20

Abstract:
A cooling system comprises a board management controller (BMC), a thermoelectric cooling (TEC) controller, and a cooling distribution unit (CDU) controller. The BMC monitors a cooling system to obtain a first power value representing a power consumed by an electronic device, performs a lookup operation in a control lookup table based on the first power value, and determines a first thermoelectric cooling (TEC) current and a first pump speed based on the lookup operation. The TEC controller is to control a TEC device attached to the electronic device to cause the first TEC current to flow within the TEC device. The CDU controller is to configure a pump speed of a fluid pump of the CDU according to the first pump speed.
Public/Granted literature
- US20220312644A1 EFFICIENT AND ROBUST SYSTEM DESIGN AND CONTROL METHOD USING THERMOELECTRIC COOLING Public/Granted day:2022-09-29
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