Invention Grant
- Patent Title: Intervertebral implant
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Application No.: US16924329Application Date: 2020-07-09
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Publication No.: US11690729B2Publication Date: 2023-07-04
- Inventor: Christian Stampfli , Mario Wyss
- Applicant: DePuy Synthes Products, Inc.
- Applicant Address: US MA Raynham
- Assignee: DEPUY SYNTHES PRODUCTS, INC.
- Current Assignee: DEPUY SYNTHES PRODUCTS, INC.
- Current Assignee Address: US MA Raynham
- Agency: BakerHostetler
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/46 ; A61F2/30

Abstract:
An intervertebral implant is disclosed. The implant can be made of Titanium or alloys thereof. A kit of intervertebral implants can be included having different lordotic profiles or having no lordotic profile. The intervertebral implants of the kit have endplates with thicknesses suitable to prevent the titanium endplates from being too stiff. The intervertebral implants can have apertures that extend through the endplates, but sufficient surface area at the outer surfaces of the endplates to avoid subsidence into the respective vertebral body.
Public/Granted literature
- US20200337851A1 INTERVERTEBRAL IMPLANT Public/Granted day:2020-10-29
Information query
IPC分类: