Invention Grant
- Patent Title: Laser cutting method for plated steel sheet, laser processing head and laser processing device
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Application No.: US16649520Application Date: 2018-10-02
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Publication No.: US11691225B2Publication Date: 2023-07-04
- Inventor: Hideo Hara , Masanori Uehara
- Applicant: AMADA HOLDINGS CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 17196013 2017.10.06
- International Application: PCT/JP2018/036799 2018.10.02
- International Announcement: WO2019/069892A 2019.04.11
- Date entered country: 2020-03-20
- Main IPC: B23K31/10
- IPC: B23K31/10 ; B23K26/14 ; B23K26/00 ; B23K26/06 ; B23K26/08 ; B23K26/12 ; B23K35/38 ; B23K37/04 ; B23K37/06 ; B23K26/38 ; B23K26/40 ; B23K103/04 ; B23K101/34
Abstract:
Laser cutting on a plated steel sheet is executed by cutting the plated steel sheet by irradiating the plated steel sheet covered with a plate metal with laser light at a wavelength in a 1 micrometer band; and emitting assist gas onto a cut surface of the plated steel sheet, the cut surface being formed in the step of cutting, to make the plate metal fused by irradiation of the laser light flow to the cut surface so as to cover the cut surface with the plate metal.
Public/Granted literature
- US20200306892A1 LASER CUTTING METHOD FOR PLATED STEEL SHEET, LASER PROCESSING HEAD AND LASER PROCESSING DEVICE Public/Granted day:2020-10-01
Information query
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