Invention Grant
- Patent Title: Three-dimensional modeling apparatus and three-dimensional modeling method
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Application No.: US17171495Application Date: 2021-02-09
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Publication No.: US11691340B2Publication Date: 2023-07-04
- Inventor: Koichi Saito , Shunsuke Mizukami , Kazuhide Nakamura
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Toyko
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Toyko
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 17089248 2017.04.28
- Main IPC: B29C64/40
- IPC: B29C64/40 ; B29C64/209 ; B29C64/295 ; B33Y70/00 ; B29C64/241 ; B33Y30/00 ; B29C64/106 ; B33Y10/00
Abstract:
A three-dimensional modeling apparatus includes a drive motor, a plasticizing section having a flat screw configured to be rotated by the drive motor, the plasticizing section being configured to plasticize and convert the material into a molten material by the rotation of the flat screw, and a nozzle configured to inject the molten material.
Public/Granted literature
- US20210162663A1 Three-Dimensional Modeling Apparatus And Three-Dimensional Modeling Method Public/Granted day:2021-06-03
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