Invention Grant
- Patent Title: Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition
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Application No.: US17109323Application Date: 2020-12-02
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Publication No.: US11691389B2Publication Date: 2023-07-04
- Inventor: Yuya Hirayama , Takayo Kitajima , Kenichi Tomioka , Keisuke Kushida , Minoru Kakitani , Hiroshi Shimizu
- Applicant: Showa Denko Materials Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: RESONAC CORPORATION
- Current Assignee: RESONAC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JP 16097483 2016.05.13 JP 16097484 2016.05.13
- The original application number of the division: US16300692
- Main IPC: C08J5/24
- IPC: C08J5/24 ; B32B27/30 ; B32B27/38 ; C08L33/08 ; B32B15/20 ; H05K1/03 ; B32B15/08 ; C08F20/12 ; C08L101/00 ; C08F220/18 ; C08J3/11 ; C08L33/06 ; C08L33/10 ; C08L33/12
Abstract:
The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.
Public/Granted literature
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