Invention Grant
- Patent Title: Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
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Application No.: US16648089Application Date: 2018-09-18
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Publication No.: US11692093B2Publication Date: 2023-07-04
- Inventor: Takeshi Kojima
- Applicant: Konica Minolta, Inc.
- Applicant Address: JP Tokyo
- Assignee: KONICA MINOLTA, INC.
- Current Assignee: KONICA MINOLTA, INC.
- Current Assignee Address: JP Tokyo
- Agency: Lucas & Mercanti, LLP
- Priority: JP 2017182476 2017.09.22
- International Application: PCT/JP2018/034504 2018.09.18
- International Announcement: WO2019/059183A 2019.03.28
- Date entered country: 2020-03-17
- Main IPC: C08L33/12
- IPC: C08L33/12 ; B33Y10/00 ; B29C64/135 ; B29C64/371 ; C08G18/00 ; C08G59/02 ; C08K3/22 ; C08K3/30 ; C08K3/34 ; C08K3/40 ; C08K7/14 ; C08K9/06 ; C08L33/08 ; C08L75/04 ; C08L83/04 ; B33Y70/10 ; B29K33/00 ; B29K75/00 ; B29K83/00 ; B29K305/00 ; B29K307/04 ; B29K309/02 ; B29K309/08

Abstract:
Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.
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