Invention Grant
- Patent Title: Method for disposal of waste printed circuit board thermal cracking slag and smelting soot
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Application No.: US17625746Application Date: 2020-11-11
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Publication No.: US11692238B2Publication Date: 2023-07-04
- Inventor: Yufeng Wu , Gongqi Liu , Bin Li
- Applicant: Beijing University of Technology
- Applicant Address: CN Beijing
- Assignee: Beijing University of Technology
- Current Assignee: Beijing University of Technology
- Current Assignee Address: CN Beijing
- Agent Leonid Kisselev
- Priority: CN 1911359327.7 2019.12.25
- International Application: PCT/CN2020/127973 2020.11.11
- International Announcement: WO2021/129205A 2021.07.01
- Date entered country: 2022-01-08
- Main IPC: C22B1/00
- IPC: C22B1/00 ; C22B1/06 ; C22B7/00 ; C22B11/00 ; C22B15/00 ; C22B19/30

Abstract:
The invention discloses a method for cracking slag and smelting soot of the waste circuit board, belongs to the field of comprehensive recycling of valuable elements from typical soot of waste circuit boards, and particularly relates to a method for cracking slag and smelting soot of the waste circuit board for debromination and comprehensive recovery of copper and zinc. The method includes the following steps of: crushing and sorting, mixture roasting, reinforced leaching, replacement and silver precipitation, sulfuration and copper precipitation, and evaporation crystallization. Compared to traditional recycling technology, the purpose of treating two kinds of solid waste in a coupling mode through one recycling technology is achieved. Through mixed sulfuric acid roasting, the requirement of bromide synergistic removal of the waste circuit board cracking slag and smelting soot is met, and the purpose of selective conversion of copper and zinc is achieved.
Public/Granted literature
- US20230037130A1 Method For Cooperative Disposal Of Waste Printed Circuit Board Thermal Cracking Slag And Smelting Ash Public/Granted day:2023-02-02
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