Invention Grant
- Patent Title: External cooling unit design for a data center with two phase fluid thermal loops
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Application No.: US16685629Application Date: 2019-11-15
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Publication No.: US11692744B2Publication Date: 2023-07-04
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: F25B9/00
- IPC: F25B9/00 ; H05K7/20 ; F24F5/00

Abstract:
A cooling system includes an ingress port to receive refrigerant in a vapor form from an evaporator, an egress port to return refrigerant in a liquid form back to the evaporator, a condenser coupled to the ingress port and the egress port, and a compressor coupled to the ingress port and the condenser. When the cooling system operates in a first mode, the condenser is configured to receive and condense the refrigerant from the vapor form into the liquid form and to return the refrigerant in the liquid form to the regress port. When the cooling system operates in a second mode, the compressor is configured to compress the refrigerant in the vapor form and to supply the compressed refrigerant to the condenser to be condensed therein.
Public/Granted literature
- US20210148608A1 EXTERNAL COOLING UNIT DESIGN FOR A DATA CENTER WITH TWO PHASE FLUID THERMAL LOOPS Public/Granted day:2021-05-20
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