Invention Grant
- Patent Title: Sensor assemblies and methods of making sensor assemblies
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Application No.: US16653218Application Date: 2019-10-15
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Publication No.: US11692909B2Publication Date: 2023-07-04
- Inventor: Muralidhar Rao Bojjanapalli , Venkata Anil Kumar Mothe , Venkatasubramanian Chockalingamaharaja
- Applicant: Rosemount Aerospace, Inc.
- Applicant Address: US MN Burnsville
- Assignee: ROSEMOUNT AEROSPACE. INC.
- Current Assignee: ROSEMOUNT AEROSPACE. INC.
- Current Assignee Address: US MN Burnsville
- Agency: Cantor Colburn LLP
- Priority: IN 1911033138 2019.08.16
- Main IPC: G01M15/02
- IPC: G01M15/02 ; F01D17/02 ; G01M15/14 ; G01D11/24 ; G01K1/12 ; G01L19/14 ; G01K1/14 ; G01D11/30
Abstract:
A sensor assembly includes a mounting portion arranged to support a sensing device, a thermal shunt portion extending from the mounting portion, and a housing portion. The housing portion extends from the thermal shunt portion and is arranged on a side of the thermal shunt portion opposite the mounting portion to limit temperature of a sensor connector fixed to the housing portion of the sensor assembly. Gas turbine engines having sensor assemblies and methods of making sensor assemblies are also described.
Public/Granted literature
- US20210048371A1 SENSOR ASSEMBLIES AND METHODS OF MAKING SENSOR ASSEMBLIES Public/Granted day:2021-02-18
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