Invention Grant
- Patent Title: Imaging device and method of manufacturing imaging device
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Application No.: US16768198Application Date: 2018-10-25
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Publication No.: US11693204B2Publication Date: 2023-07-04
- Inventor: Junichi Tokunaga , Yuuji Kishigami , Noboru Kawabata , Yoshihiro Nabe
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JP 2017235671 2017.12.08
- International Application: PCT/JP2018/039629 2018.10.25
- International Announcement: WO2019/111575A 2019.06.13
- Date entered country: 2020-05-29
- Main IPC: G02B7/02
- IPC: G02B7/02 ; H04N23/51 ; H04N23/57

Abstract:
To improve strength of an imaging module with an adjusted optical axis. An imaging device includes an imaging module and a holding unit. The imaging module provided in the imaging device includes an imaging element that images incident light introduced from an upper surface of a housing. The holding unit provided in the imaging device surrounds and holds a side surface of the imaging module, the side surface being adjacent to the upper surface of the housing. The holding unit surrounds and holds the side surface of the imaging module, thereby protecting the imaging module.
Public/Granted literature
- US20200292775A1 IMAGING DEVICE AND METHOD OF MANUFACTURING IMAGING DEVICE Public/Granted day:2020-09-17
Information query
IPC分类:
G | 物理 |
G02 | 光学 |
G02B | 光学元件、系统或仪器 |
G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
G02B7/02 | .用于透镜 |