Invention Grant
- Patent Title: Temperature-based on board placement of memory devices
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Application No.: US16930158Application Date: 2020-07-15
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Publication No.: US11694017B2Publication Date: 2023-07-04
- Inventor: Zhenlei Shen , Tingjun Xie , Charles See Yeung Kwong
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F30/00
- IPC: G06F30/00 ; G06F30/398 ; G06F30/392 ; G06F11/30 ; G06F119/08

Abstract:
A quality rating for a memory device to be installed at a memory sub-system is determined, where the quality rating corresponds to a performance of the memory device at one or more operating temperatures. A determination is made whether the quality rating for the memory device satisfies a first quality rating condition associated with a first temperature zone of two or more temperature zones of the memory sub-system. Responsive to the determination that the quality rating for the memory device satisfies the first quality rating condition, the memory device is assigned to be installed at a first memory device socket of the first temperature zone.
Public/Granted literature
- US20220019722A1 TEMPERATURE-BASED ON BOARD PLACEMENT OF MEMORY DEVICES Public/Granted day:2022-01-20
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