Invention Grant
- Patent Title: Semiconductor memory device that provides a memory die
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Application No.: US17469095Application Date: 2021-09-08
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Publication No.: US11694754B2Publication Date: 2023-07-04
- Inventor: Yuzuru Shibazaki
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 20204377 2020.12.09
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C16/32 ; G11C16/34 ; G11C16/10 ; G11C16/04

Abstract:
ABSTRACT A semiconductor memory device provides a first memory cell array including a plurality of first memory blocks, a second memory cell array comprising a plurality of second memory blocks, and a voltage supply line electrically connected to the plurality of first memory blocks and the plurality of second memory blocks. Moreover, this semiconductor memory device is configured to execute a write operation. At a first timing of this write operation, the voltage supply line is not electrically continuous with the first and second memory blocks. Moreover, a voltage of the voltage supply line at the first timing in the case of the write operation being executed on the first and second memory blocks is larger than a voltage of the voltage supply line at the first timing in the case of the write operation being executed on the first memory block.
Public/Granted literature
- US20220180945A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2022-06-09
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