Invention Grant
- Patent Title: Base configured as an electronic component or a circuit board
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Application No.: US16890947Application Date: 2020-06-02
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Publication No.: US11694839B2Publication Date: 2023-07-04
- Inventor: Namiko Sasajima , Hiroki Imaeda , Masami Okado , Shinji Otani , Tomohiro Sunaga , Yoshimasa Yoshioka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 19132821 2019.07.18
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00

Abstract:
A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.
Public/Granted literature
- US20210020326A1 BASE Public/Granted day:2021-01-21
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