Invention Grant
- Patent Title: Multilayer capacitor and method of manufacturing the same
-
Application No.: US17320966Application Date: 2021-05-14
-
Publication No.: US11694843B2Publication Date: 2023-07-04
- Inventor: Yun Sung Kang , Min Jung Cho , Yun Hee Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200146115 2020.11.04
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/248 ; H01G4/008

Abstract:
A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.
Public/Granted literature
- US20220139616A1 MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-05-05
Information query