Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US17580813Application Date: 2022-01-21
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Publication No.: US11694882B2Publication Date: 2023-07-04
- Inventor: Yuji Takanami , Kento Norota , Naoyuki Okamoto , Yasuo Kato , Yasushi Yasumatsu
- Applicant: Canon Anelva Corporation
- Applicant Address: JP Kawasaki
- Assignee: CANON ANELVA CORPORATION
- Current Assignee: CANON ANELVA CORPORATION
- Current Assignee Address: JP Kawasaki
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP 18019569 2018.02.06
- The original application number of the division: US16928086 2020.07.14
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/34 ; C23C14/46 ; H01J37/32

Abstract:
A substrate processing apparatus that processes a substrate using particles, includes a conveyance mechanism configured to convey the substrate along a conveyance surface, a particle source configured to emit particles, a rotation mechanism configured to make the particle source pivot about a rotation axis, and a movement mechanism configured to move the particle source such that a distance between the particle source and the conveyance surface is changed.
Public/Granted literature
- US20220139686A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2022-05-05
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