Invention Grant
- Patent Title: Substrate support device, thermal processing apparatus, substrate support method, and thermal processing method
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Application No.: US17079895Application Date: 2020-10-26
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Publication No.: US11694920B2Publication Date: 2023-07-04
- Inventor: Scott Prengle
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP 19212552 2019.11.25
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L21/67 ; H01L21/687 ; H01L21/268 ; H05B3/00 ; H01L21/677
Abstract:
A substrate support device relating to technology disclosed in the description of the present application includes: a holding plate for opposing a substrate bowable by being heated by irradiation with flash light; and a plurality of substrate support pins provided on the holding plate and being for supporting the substrate, wherein the plurality of substrate support pins are arranged at locations where a volume of a space between the holding plate and the substrate in an unbowed state and a volume of a space between the holding plate and the substrate in a bowed state are equal to each other. Breakage of the substrate can be suppressed in a case where the substrate is bowed by flash light.
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