Invention Grant
- Patent Title: Semiconductor structure and fabrication method thereof
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Application No.: US17212904Application Date: 2021-03-25
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Publication No.: US11695035B2Publication Date: 2023-07-04
- Inventor: Meng Zhao
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN 2010290935.3 2020.04.14
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06

Abstract:
A semiconductor structure and a method for forming the semiconductor structure are provided. The semiconductor structure includes a substrate and a dummy gate structure on the substrate. The substrate contains source-drain openings on both sides of the dummy gate structure. The semiconductor structure also includes a first stress layer formed on a sidewall of a source-drain opening of the source-drain openings. Further, the semiconductor structure includes a second stress layer formed at a bottom of the source-drain opening and on the first stress layer. The second stress layer fully fills the source-drain opening, and stress of the first stress layer is less than stress of the second stress layer.
Public/Granted literature
- US20210320169A1 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2021-10-14
Information query
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