A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating, the first dimension is larger than the second dimension. The heating unit includes an electrically conductive lead heated by an electrical current flowing through the electrically conductive lead and a heat spreading layer arranged in thermal contact with the electrically conductive lead and distributing a heat generated by the electrically conductive lead.