Invention Grant
- Patent Title: Coil substrate and motor coil substrate
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Application No.: US17386957Application Date: 2021-07-28
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Publication No.: US11695309B2Publication Date: 2023-07-04
- Inventor: Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Gifu
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 20141001 2020.08.24
- Main IPC: H02K3/26
- IPC: H02K3/26

Abstract:
A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.
Public/Granted literature
- US20220060074A1 COIL SUBSTRATE AND MOTOR COIL SUBSTRATE Public/Granted day:2022-02-24
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