Invention Grant
- Patent Title: Bulk-acoustic wave resonator
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Application No.: US16449561Application Date: 2019-06-24
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Publication No.: US11695385B2Publication Date: 2023-07-04
- Inventor: Tae Kyung Lee , Je Hong Kyoung , Sung Sun Kim , Jin Suk Son , Ran Hee Shin , Hwa Sun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20190017637 2019.02.15
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/17

Abstract:
A bulk-acoustic wave resonator comprises a substrate, a resonant portion comprising a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on the substrate, and further comprising a center portion and an extension portion that is disposed along a periphery of the center portion, and an insertion layer that is disposed in the extension portion between the first electrode and the piezoelectric layer, and the insertion layer is formed of an aluminum alloy containing scandium (Sc).
Public/Granted literature
- US20200266795A1 BULK-ACOUSTIC WAVE RESONATOR Public/Granted day:2020-08-20
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