Invention Grant
- Patent Title: Parity interleaving apparatus for encoding fixed-length signaling information, and parity interleaving method using same
-
Application No.: US17522990Application Date: 2021-11-10
-
Publication No.: US11695433B2Publication Date: 2023-07-04
- Inventor: Sung-Ik Park , Sun-Hyoung Kwon , Jae-Young Lee , Heung-Mook Kim
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: NSIP Law
- Priority: KR 20150028061 2015.02.27 KR 20150031948 2015.03.06 KR 20160020868 2016.02.22
- Main IPC: H03M13/27
- IPC: H03M13/27 ; H03M13/25 ; H03M13/00 ; H04L1/00 ; H03M13/11 ; H03M13/15 ; H03M13/29
Abstract:
A parity interleaving apparatus and method for fixed length signaling information are disclosed. A parity interleaving apparatus according to an embodiment of the present invention includes a processor configured to generate a parity bit string for parity puncturing by segmenting parity bits of an LDPC codeword whose length is 16200 and whose code rate is 3/15, into a plurality of groups, and group-wise interleaving the groups using an order of group-wise interleaving; and memory configured to provide the parity bit string for parity puncturing to a parity puncturing unit.
Public/Granted literature
Information query
IPC分类:
