Invention Grant
- Patent Title: Method and apparatus for implementing dual connectivity
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Application No.: US17100745Application Date: 2020-11-20
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Publication No.: US11695522B2Publication Date: 2023-07-04
- Inventor: Himke Van Der Velde , Soenghun Kim , Gert-Jan Van Lieshout
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: GB 01737 2014.01.31
- Main IPC: H04L5/00
- IPC: H04L5/00 ; H04W76/40 ; H04W76/15 ; H04W88/06 ; H04W92/20 ; H04W76/22 ; H04W76/20 ; H04W76/12

Abstract:
A wireless access node (e.g. a master eNB (MeNB)) is described for a wireless communication system that comprises a first wireless access network and a second wireless access network supporting a dual connectivity terminal device arranged to communicate with both the wireless access node (MeNB) on the first wireless access network and a second wireless access node (e.g. a secondary eNB (SeNB)) on the second wireless access network is provided. The wireless access node comprises a communication unit and a controller. The controller is operably coupled to the communication unit and configured to control the communication unit to transmit a first message including configuration information for a secondary cell group (SCG) to perform a certain action, to the other base station, and to receive a second message in response to the first message from the other base station, and to control the communication to transmit a third message based on the second message to the terminal, wherein the configuration information includes multimedia broadcast multicast service (MBMS) interest information.
Public/Granted literature
- US20210075567A1 METHOD AND APPARATUS FOR IMPLEMENTING DUAL CONNECTIVITY Public/Granted day:2021-03-11
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