Invention Grant
- Patent Title: Multi-level signal transmitter and method thereof
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Application No.: US17233597Application Date: 2021-04-19
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Publication No.: US11695596B2Publication Date: 2023-07-04
- Inventor: Ting-Hsu Chien , Chia-Liang (Leon) Lin
- Applicant: Realtek Semiconductor Corp.
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H04L25/03
- IPC: H04L25/03 ; H04L25/02 ; H04L25/49

Abstract:
A multi-level signal transmitter includes an encoder figured to receive an input data and output a plurality of logical signal sets, each of said plurality of logical signal sets comprising a plurality of logical signals; and a plurality of tree-structured drivers configured to receive said plurality of logical signal sets, respectively, and jointly establish an output voltage at an output node, wherein each of said tree-structure drivers comprises a plurality of inverters configured to receive said plurality of logical signals of its respective logical signal set and jointly establish a joint voltage at a bifurcation node via coupling to the bifurcation node through a plurality of first-level weighting resistors, and a second-level weighting resistor configured to couple the bifurcation node to the output node.
Public/Granted literature
- US20220337458A1 MULTI-LEVEL SIGNAL TRANSMITTER AND METHOD THEREOF Public/Granted day:2022-10-20
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