Invention Grant
- Patent Title: Multi-camera on a chip and camera module design
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Application No.: US17527155Application Date: 2021-11-15
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Publication No.: US11696003B2Publication Date: 2023-07-04
- Inventor: Yibing Michelle Wang , Radwanul Hasan Siddique , Kwang Oh Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Renaissance IP Law Group LLP
- Main IPC: H04N23/45
- IPC: H04N23/45 ; H04N23/55 ; H04N23/80

Abstract:
A camera system includes two or more sensor arrays and an optical path. The sensor arrays are on the same sensor chip. Each sensor array includes the same field of view (FOV) as each other sensor array. The optical path includes a main lens and a metalens that are shared by each sensor array, and a microlens associated with each sensor array. The metalens splits incident light into different spectrums of light and directs each respective spectrum to a corresponding sensor array. The different spectrums of light include at least two of visible light, near infrared light, shortwave infrared and longwave infrared, and at least one sensor array includes single-photon avalanche diodes. The image processor that provides image processing, object recognition and object tracking and/or image fusion functionality may be on the same sensor chip as the sensor arrays.
Public/Granted literature
- US20220078318A1 MULTI-CAMERA ON A CHIP AND CAMERA MODULE DESIGN Public/Granted day:2022-03-10
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