Invention Grant
- Patent Title: Uplink channel repetitions with inter-BWP frequency hopping
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Application No.: US17224029Application Date: 2021-04-06
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Publication No.: US11696269B2Publication Date: 2023-07-04
- Inventor: Yongjun Kwak , Jing Lei , Huilin Xu , Yuchul Kim , Hwan Joon Kwon , Peter Gaal
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm/Norton Rose Fulbright US LLP
- Agent Kevin T. Cheatham
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04W72/0453 ; H04J1/16

Abstract:
This disclosure provides systems, methods, and devices for wireless communication that support inter-slot bundling and frequency hopping. In a first aspect, a method of wireless communication includes receiving a message indicating inter-slot bundling for uplink channel inter-bandwidth part (BWP) frequency hopping repetitions. The method also includes receiving bundling information and redundancy value (RV) information for an uplink channel transmission and corresponding uplink channel transmission repetitions. The method includes transmitting the uplink channel transmission with inter-slot bundling and frequency hopping and based on the bundling information and the RV information. The method further include transmitting an uplink channel transmission repetition of the uplink channel transmission with inter-slot bundling and frequency hopping and based on the bundling information and the RV information. Other aspects and features are also claimed and described.
Public/Granted literature
- US20220322345A1 UPLINK CHANNEL REPETITIONS WITH INTER-BWP FREQUENCY HOPPING Public/Granted day:2022-10-06
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