Invention Grant
- Patent Title: Circuit board
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Application No.: US17635916Application Date: 2020-09-15
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Publication No.: US11696399B2Publication Date: 2023-07-04
- Inventor: Changgang Yin , Bi Yi , Zhongmin Wei
- Applicant: ZTE Corporation
- Applicant Address: CN Shenzhen
- Assignee: ZTE CORPORATION
- Current Assignee: ZTE CORPORATION
- Current Assignee Address: CN Shenzhen
- Agency: Vivacqua Crane, PLLC
- Priority: CN 1910872663.5 2019.09.16
- International Application: PCT/CN2020/115357 2020.09.15
- International Announcement: WO2021/052327A 2021.03.25
- Date entered country: 2022-02-16
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).
Public/Granted literature
- US20220304152A1 CIRCUIT BOARD Public/Granted day:2022-09-22
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