Invention Grant
- Patent Title: Electronic device including structure for stacking substrates
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Application No.: US17139365Application Date: 2020-12-31
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Publication No.: US11696404B2Publication Date: 2023-07-04
- Inventor: Manho Kim , Hwajoong Jung , Kihuk Lee , Yonghwan Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR 20200001030 2020.01.03
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/02 ; H05K1/11

Abstract:
An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.
Public/Granted literature
- US20210212209A1 ELECTRONIC DEVICE INCLUDING STRUCTURE FOR STACKING SUBSTRATES Public/Granted day:2021-07-08
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