- Patent Title: Vertical embedded component in a printed circuit board blind hole
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Application No.: US16325659Application Date: 2016-09-30
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Publication No.: US11696409B2Publication Date: 2023-07-04
- Inventor: Tin Poay Chuah , Min Suet Lim , Hoay Tien Teoh , Mooi Ling Chang , Chin Lee Kuan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- International Application: PCT/US2016/054643 2016.09.30
- International Announcement: WO2018/063279A 2018.04.05
- Date entered country: 2019-02-14
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K1/16
Abstract:
A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via.
Public/Granted literature
- US20190208643A1 VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE Public/Granted day:2019-07-04
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