- Patent Title: Sleeve soldering device and method of producing electronic device
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Application No.: US16874711Application Date: 2020-05-15
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Publication No.: US11696411B2Publication Date: 2023-07-04
- Inventor: Hayato Kiuchi , Atsushi Furumoto , Kazuyuki Hamamoto , Teruhiko Iwase , Masayuki Fujihira
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 2019093025 2019.05.16
- Main IPC: B23K3/00
- IPC: B23K3/00 ; H05K3/34 ; B23K1/00 ; B23K3/047 ; B23K3/03 ; G05D23/24 ; B23K101/42

Abstract:
A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.
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