Invention Grant
- Patent Title: Compact EEPROM memory cell with a gate dielectric layer having two different thicknesses
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Application No.: US16928465Application Date: 2020-07-14
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Publication No.: US11696438B2Publication Date: 2023-07-04
- Inventor: François Tailliet
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Slater Matsil, LLP
- Priority: FR 58697 2017.09.20
- The original application number of the division: US16130593 2018.09.13
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H10B41/00 ; H01L29/423 ; G11C7/18 ; H01L29/66 ; G11C16/04 ; H01L21/28 ; G11C16/08 ; G11C16/24 ; H10B41/35 ; H01L29/788

Abstract:
An EEPROM memory integrated circuit includes memory cells arranged in a memory plane. Each memory cell includes an access transistor in series with a state transistor. Each access transistor is coupled, via its source region, to the corresponding source line and each state transistor is coupled, via its drain region, to the corresponding bit line. The floating gate of each state transistor rests on a dielectric layer having a first part with a first thickness, and a second part with a second thickness that is less than the first thickness. The second part is located on the source side of the state transistor.
Public/Granted literature
- US20200343254A1 COMPACT EEPROM MEMORY CELL WITH A GATE DIELECTRIC LAYER HAVING TWO DIFFERENT THICKNESSES Public/Granted day:2020-10-29
Information query
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