Invention Grant
- Patent Title: Phase-change memory and method of forming same
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Application No.: US17666230Application Date: 2022-02-07
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Publication No.: US11696519B2Publication Date: 2023-07-04
- Inventor: Jau-Yi Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16727363 2019.12.26
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24 ; H10N70/00 ; H10B63/00 ; H10N70/20

Abstract:
A device and a method of forming the same are provided. The device includes a substrate, a first dielectric layer over the substrate, a bottom electrode extending through the first dielectric layer, a first buffer layer over the bottom electrode, a phase-change layer over the first buffer layer, a top electrode over the phase-change layer, and a second dielectric layer over the first dielectric layer. The second dielectric layer surrounds the phase-change layer and the top electrode. A width of the top electrode is greater than a width of the bottom electrode.
Public/Granted literature
- US20220158089A1 Phase-Change Memory and Method of Forming Same Public/Granted day:2022-05-19
Information query
IPC分类: