A cleaning apparatus for a tool is provided. The cleaning apparatus includes a support structure having a first base portion, and a nozzle disposed on the first base portion of the support structure. The cleaning apparatus further includes circuitry that is communicatively coupled to an electronically-actuated fluid release mechanism and a robot. The circuitry determines a count of operation cycles of the tool coupled to an end-effector of the robot and instructs the robot to align the tool with the nozzle. The instruction is provided to the robot based on a determination that the determined count is greater than or equal to a threshold number. The circuitry controls the electronically-actuated fluid release mechanism based on whether the tool is aligned with the nozzle, to release a cleaning fluid through the nozzle for a first time-duration to clean the tool.