The present disclosure is drawn to a material set including a powder bed material and a binder fluid. The powder bed material can be from 80 wt % to 100 wt % metal particles having a metal core and a thin metal layer on the core, and the metal particles having a D50 particle size distribution value ranging from 4 μm to 150 μm and the thin metal layer having an average thickness from 20 nm to 2 μm. The binder fluid can adhere a first portion of the powder bed material relative to a second portion of the powder bed material not in contact with the binder fluid.