Invention Grant
- Patent Title: Three-dimensional shaping method
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Application No.: US17122430Application Date: 2020-12-15
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Publication No.: US11697158B2Publication Date: 2023-07-11
- Inventor: Akihiko Tsunoya
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP 19228029 2019.12.18
- Main IPC: B22F10/47
- IPC: B22F10/47 ; B33Y10/00 ; B22F10/14 ; B28B11/24 ; B22F10/43

Abstract:
A three-dimensional shaping method includes a molded body forming step of forming a molded body having a plurality of projection portions using a material containing a powder and a binder, a supporting step of supporting the molded body by a support having groove portions at positions configured to insert each of the projection portions in a state where the plurality of projection portions are inserted into the groove portions, and a sintering step of sintering the powder by heating the molded body in a state of being supported by the support, wherein the groove portion is extended from an insertion position of the projection portion in a specified direction that specifies a direction of shrinkage of the molded body by performing the sintering step.
Public/Granted literature
- US20210187616A1 THREE-DIMENSIONAL SHAPING METHOD Public/Granted day:2021-06-24
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