Invention Grant
- Patent Title: Three-dimensional shaping device and method for manufacturing three-dimensional shaped object
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Application No.: US17104073Application Date: 2020-11-25
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Publication No.: US11697159B2Publication Date: 2023-07-11
- Inventor: Hiroki Kobayashi , Kazuhide Nakamura , Koichi Saito
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 19214120 2019.11.27
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y50/02 ; B29C64/209 ; B22F12/53 ; B29C64/118 ; B33Y10/00 ; B33Y30/00 ; B22F10/00 ; B22F12/52 ; B22F12/57 ; B22F12/90 ; B22F10/18 ; B22F10/22

Abstract:
A three-dimensional shaping device includes: a discharge unit configured to discharge a shaping material; a weight measuring unit configured to measure a weight of the shaping material discharged from the discharge unit; and a control unit configured to control the discharge unit and the weight measuring unit to shape a three-dimensional shaped object by stacking layers of the shaping material in a shaping region of a stage, in which the control unit is configured to control the weight measuring unit to measure the weight of the shaping material discharged from the discharge unit, determine whether a predetermined amount of the shaping material is discharged from the discharge unit based on the weight measured by the weight measuring unit, and when it is determined that the predetermined amount of the shaping material is not discharged, control the discharge unit so that the predetermined amount of the shaping material is discharged from the discharge unit.
Public/Granted literature
- US20210154941A1 Three-Dimensional Shaping Device and Method for Manufacturing Three-Dimensional Shaped Object Public/Granted day:2021-05-27
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