Invention Grant
- Patent Title: Systems and methods for joining and repair using ultrasonic additive manufacturing with a contoured sonotrode
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Application No.: US17013128Application Date: 2020-09-04
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Publication No.: US11697172B2Publication Date: 2023-07-11
- Inventor: Marcelo Dapino , Leon Headings , Mark Gingerich
- Applicant: Ohio State Innovation Foundation
- Applicant Address: US OH Columbus
- Assignee: Ohio State Innovation Foundation
- Current Assignee: Ohio State Innovation Foundation
- Current Assignee Address: US OH Columbus
- Agency: Meunier Carlin & Curfman LLC
- Main IPC: B23K20/10
- IPC: B23K20/10 ; B33Y30/00 ; B23P6/00 ; B33Y10/00
Abstract:
An ultrasonic additive manufacturing system may include a base structure, a sonotrode configured to rotate about an axis of rotation, and one or more transducers configured to vibrate the sonotrode. The sonotrode may include a welding surface extending along a circumference of the sonotrode, and the welding surface may have a contoured profile. At least one of the sonotrode and the base structure may be configured to translate relative to the other of the sonotrode and the base structure.
Public/Granted literature
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