Invention Grant
- Patent Title: Clamping device and workpiece clamping method
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Application No.: US17672763Application Date: 2022-02-16
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Publication No.: US11697190B2Publication Date: 2023-07-11
- Inventor: Taisuke Morimoto , Yosuke Ikadai , Kazuma Nakayama , Tohru Takamura , Ryunosuke Hozawa
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JP 21038706 2021.03.10
- Main IPC: B25B5/12
- IPC: B25B5/12 ; B62D65/02 ; B25B5/00 ; B25B5/02 ; B25B5/16 ; B25B5/14

Abstract:
A clamping device includes a cylinder, a base body, a movable plate, and holding pins. The movable plate is attached to the base body substantially parallel thereto via two pairs of link arms. The movable plate moves along the operating direction of the cylinder. The movable plate can abut against a width-direction side surface of a workpiece. The holding pins are attached to the movable plate. The holding pins abut against an upper portion of the workpiece.
Public/Granted literature
- US20220288750A1 CLAMPING DEVICE AND WORKPIECE CLAMPING METHOD Public/Granted day:2022-09-15
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