A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.