Invention Grant
- Patent Title: Negative-working ultra thick film photoresist
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Application No.: US16966998Application Date: 2019-03-20
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Publication No.: US11698586B2Publication Date: 2023-07-11
- Inventor: Aritaka Hishida , Hisashi Motobayashi , Lei Lu , Chunwei Chen , PingHung Lu , Weihong Liu
- Applicant: Merck Patent GmbH
- Applicant Address: DE Darmstadt
- Assignee: Merck Patent GmbH
- Current Assignee: Merck Patent GmbH
- Current Assignee Address: DE Darmstadt
- Agent Francis M. Houlihan
- International Application: PCT/EP2019/056911 2019.03.20
- International Announcement: WO2019/180058A 2019.09.26
- Date entered country: 2020-08-03
- Main IPC: G03F7/029
- IPC: G03F7/029 ; G03F7/004 ; G03F7/031

Abstract:
A negative working, aqueous base developable, photosensitive photoresist composition and a process of using this composition to produce lithographic images, where this composition is one comprising: a) a polymer containing the four repeat units of structures (1), (2), (3), and (4), but no other types of repeat units; wherein v, x, y and z, respectively, represent the mole % of each repeat units of structures (1), (2), (3) and (4); b) a radical photo-initiator component, which is comprised of at least one radical photo initiator which is activated by a broad absorption of radiation from about 360 nm to about 440 nm; c) a crosslinker component which is either a mixture consisting of crosslinkers of structure (5), (6) and (7), or a single crosslinker of structure (8); d) a radical inhibitor component; e) an optional surfactant component; f) an optional dissolution promoter component; and g) a solvent. The invention also relates to the process of using this negative resist to produce lithographic images.
Information query
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